Organization

Links

Important Dates

Submission Deadline

June 30, 2025

Notification of Acceptance

July 31, 2025

Camera Ready Submission

August 31, 2025

Registration Deadline

August 31, 2025

Contact Us

Conference Secretory
Email: icdis@acamail.org

General Chair

Fushuan Wen, Zhejiang University, China

Technical Committee Chair

Bimal K. Bose, The University of Tennessee, Knoxville, USA

Ljiljana Trajkovic, Simon Fraser University, Canada

Yang Yue, Xi'an Jiaotong University, China

Technical Committee Member

Ashish Sharma, Manipal University Jaipur, India

CH Hussaian Basha, SR University, India

Esteban Tlelo-Cuautle, Instituto Nacional de Astrofísica, Óptica y Electrónica, Mexico

Fanyi Meng, Tianjin University, China

Fei Yuan, Toronto Metropolitan University, Canada

Frank Werner, Otto-von-Guericke-Universität Magdeburg, Germany

Guennadi A. Kouzaev, Norwegian University of Science and Technology, Norway

Gwee Bah Hwee, Nanyang Technological University, Singapore

Huipeng Chen, Fuzhou University, China

Jaker Hossain, University of Rajshahi, Bangaldesh

K. N. Bharath, GM Institute of Technology, India

Luigi Fortuna, University of Catania, Italy

Mihaela Popescu, University of Craiova, Romania

Mohammad Alibakhshikenari, Universidad Carlos III de Madrid, Spain

Padmanabhan Balasubramanian, Nanyang Technological University, Singapore

Patrick Siarry, Université Paris-Est Créteil, France

Peter Sachsenmeier, Hankou University, China

Prashant Kasambe, Saradr Patel Institute of Technology, India

Qingrui Meng, Qualcomm, USA

Sadegh Vaez-Zadeh, University of Tehran, Iran

Sagar Juneja,Chitkara University, India

Saurabh Kotiyal, Intel Corporation, USA

Sayak Chakraborti, Meta Platforms Inc., USA

Sheikh Rashel Al Ahmed, Pabna University of Science and Technology, Bangladesh

Shuilin Tian, Innoscience, China

Smain Femmam, UHA University, France

Taha Elwi, Al-Mammon University College, Iraq

Tee Hui Teo, Singapore University of Technology and Design, Singapore

Xiangdong Zhang, Beijing Institute of Technology, China

Yongle Wu, Beijing University of Posts and Telecommunications, China

Sponsor

University of Campinas